A discrete dislocation approach to grain boundary diffusion

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Abstract

Stresses, and their relaxation, in thin films at size scales on the order of (sub)micrometers are critical to the mechanical reliability of small devices. In this study we present a discrete dislocation dynamics framework to describe diffusional stress relaxation. We find a nearly linear relationship between the relaxed, residual tensile stress and grain size. The origin lies in the amount of diffused material and the opening profile along the grain boundary.

Original languageEnglish
Title of host publicationProceedings of 4th International Conference on Multiscale Materials Modeling, MMM 2008
EditorsAnter El-Azab
PublisherDepartment of Scientific Computing, Florida State University
Pages768-771
Number of pages4
ISBN (Electronic)9780615247816
Publication statusPublished - 2008
Event4th International Conference on Multiscale Materials Modeling, MMM 2008 - Tallahassee, United States
Duration: 27-Oct-200831-Oct-2008

Publication series

NameProceedings of 4th International Conference on Multiscale Materials Modeling, MMM 2008

Conference

Conference4th International Conference on Multiscale Materials Modeling, MMM 2008
Country/TerritoryUnited States
CityTallahassee
Period27/10/200831/10/2008

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