Electro-deposition as a repair method for embedded metal grids

A. Jolt Oostra; Anil Reddy; Edsger C. P. Smits; Robert Abbel; Wilhelm A. Groen; Paulw. M. Blom; Jasper J. Michels

doi:10.1016/j.tsf.2016.01.060

Electro-deposition as a repair method for embedded metal grids

A. Jolt Oostra
, Anil Reddy
, Edsger C. P. Smits
, Robert Abbel
, Wilhelm A. Groen
, Paulw. M. Blom
, Jasper J. Michels^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › Academic › peer-review

3 Citations (Scopus)

94 Downloads (Pure)

Abstract

A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance. (C) 2016 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	202-205
Number of pages	4
Journal	Thin Solid Films
Volume	603
DOIs	https://doi.org/10.1016/j.tsf.2016.01.060
Publication status	Published - 31-Mar-2016

Keywords

Repair
Electromigration
Metal grid
Organic light emitting diodes
Organic photovoltaics
Devices
SILVER NANOPARTICLE INKS
CURRENT COLLECTING GRIDS
ORGANIC SOLAR-CELLS

Access to Document

10.1016/j.tsf.2016.01.060

Electro-deposition as a repair method for embedded metal gridsFinal publisher's version, 732 KBLicence: Taverne

Handle.net

Persistent link

Cite this

@article{634672760e2945c7b40f94713def9bcd,

title = "Electro-deposition as a repair method for embedded metal grids",

abstract = "A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance. (C) 2016 Elsevier B.V. All rights reserved.",

keywords = "Repair, Electromigration, Metal grid, Organic light emitting diodes, Organic photovoltaics, Devices, SILVER NANOPARTICLE INKS, CURRENT COLLECTING GRIDS, ORGANIC SOLAR-CELLS",

author = "Oostra, \{A. Jolt\} and Anil Reddy and Smits, \{Edsger C. P.\} and Robert Abbel and Groen, \{Wilhelm A.\} and Blom, \{Paulw. M.\} and Michels, \{Jasper J.\}",

year = "2016",

month = mar,

day = "31",

doi = "10.1016/j.tsf.2016.01.060",

language = "English",

volume = "603",

pages = "202--205",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier Science",

}

TY - JOUR

T1 - Electro-deposition as a repair method for embedded metal grids

AU - Oostra, A. Jolt

AU - Reddy, Anil

AU - Smits, Edsger C. P.

AU - Abbel, Robert

AU - Groen, Wilhelm A.

AU - Blom, Paulw. M.

AU - Michels, Jasper J.

PY - 2016/3/31

Y1 - 2016/3/31

N2 - A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance. (C) 2016 Elsevier B.V. All rights reserved.

AB - A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance. (C) 2016 Elsevier B.V. All rights reserved.

KW - Repair

KW - Electromigration

KW - Metal grid

KW - Organic light emitting diodes

KW - Organic photovoltaics

KW - Devices

KW - SILVER NANOPARTICLE INKS

KW - CURRENT COLLECTING GRIDS

KW - ORGANIC SOLAR-CELLS

U2 - 10.1016/j.tsf.2016.01.060

DO - 10.1016/j.tsf.2016.01.060

M3 - Article

SN - 0040-6090

VL - 603

SP - 202

EP - 205

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Electro-deposition as a repair method for embedded metal grids

Abstract

Keywords

Access to Document

Handle.net

Fingerprint

Cite this