Plasticity in polycrystalline thin films: A 2D dislocation dynamics approach

L Nicola*, E Van der Giessen, A Needleman

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)

Abstract

Thermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film-substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.

Original languageEnglish
Title of host publicationMULTISCALE PHENOMENA IN MATERIALS-EXPERIMENTS AND MODELING RELATED TO MECHANICAL BEHAVIOR
EditorsHM Zbib, DH Lassila, LE Levine, KJ Hemker
Place of PublicationWARRENDALE
PublisherMaterials Research Society
Pages159-163
Number of pages5
ISBN (Print)1-55899-716-4
Publication statusPublished - 2003
EventSymposium on Multiscale Phenomena in Materials-Experiments and Modeling Related to Mechanical Behavior held at the 2003 MRS Spring Meeting - , Canada
Duration: 22-Apr-200324-Apr-2003

Publication series

NameMATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
PublisherMATERIALS RESEARCH SOCIETY
Volume779
ISSN (Print)0272-9172

Other

OtherSymposium on Multiscale Phenomena in Materials-Experiments and Modeling Related to Mechanical Behavior held at the 2003 MRS Spring Meeting
Country/TerritoryCanada
Period22/04/200324/04/2003

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