Simulations of dislocation dynamics in aluminum interconnects

L Nicola*, E Van der Giessen, A Needleman

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)

Abstract

A discrete dislocation simulation of plastic deformation in metallic interconnects caused by thermal stress is carried out. The calculations are carried out using a two dimensional plane strain formulation with only edge dislocations. A boundary value problem is formulated and solved for the evolution of the thermal stress field and the evolution of the dislocation structure in the cross-section of the line as cooling proceeds. For lines with a small cross section (height or width less than 1 mum), the local concentration of stresses due to dislocation patterning strongly affects the overall stress build up and relaxation. The results show a clear dependence of the transverse stress development on the line aspect ratio.

Original languageEnglish
Title of host publicationMODELING AND NUMERICAL SIMULATION OF MATERIALS BEHAVIOR AND EVOLUTION
EditorsA Zavaliangos, Tikare, EA Olevsky
Place of PublicationWARRENDALE
PublisherMaterials Research Society
Pages41-46
Number of pages6
ISBN (Print)1-55899-667-2
Publication statusPublished - 2002
EventSymposium on Modeling and Numerical Simulation of Materials Behavior and Evolution held at the 2002 MRS Spring Meeting - , Canada
Duration: 2-Apr-20025-Apr-2002

Publication series

NameMATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
PublisherMATERIALS RESEARCH SOCIETY
Volume731
ISSN (Print)0272-9172

Other

OtherSymposium on Modeling and Numerical Simulation of Materials Behavior and Evolution held at the 2002 MRS Spring Meeting
Country/TerritoryCanada
Period02/04/200205/04/2002

Keywords

  • PLASTICITY
  • STRESSES
  • LAYERS

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