Strategies for Enhancing the Dielectric Constant of Organic Materials

Selim Sami*, Riccardo Alessandri, Jeff B. Jeff, Fabian Grünewald, Alex H. De Vries, Siewert J. Marrink, Ria Broer, Remco W.A. Havenith*

*Corresponding author for this work

Research output: Contribution to journalArticleAcademicpeer-review

5 Citations (Scopus)
23 Downloads (Pure)

Abstract

High dielectric constant organic semiconductors, often obtained by the use of ethylene glycol (EG) side chains, have gained attention in recent years in the efforts of improving the device performance for various applications. Dielectric constant enhancements due to EGs have been demonstrated extensively, but various effects, such as the choice of the particular molecule and the frequency and temperature regime, that determine the extent of this enhancement require further understanding. In this work, we study these effects by means of polarizable molecular dynamics simulations on a carefully selected set of fullerene derivatives with EG side chains. The selection allows studying the dielectric response in terms of both the number and length of EG chains and also the choice of the group connecting the fullerene to the EG chain. The computed time- and frequency-dependent dielectric responses reveal that the experimentally observed rise of the dielectric constant within the kilo/megahertz regime for some molecules is likely due to the highly stretched dielectric response of the EGs: the initial sharp increase over the first few nanoseconds is followed by a smaller but persistent increase in the range of microseconds. Additionally, our computational protocol allows the separation of different factors that contribute to the overall dielectric constant, providing insights to make several molecular design guides for future organic materials in order to enhance their dielectric constant further.

Original languageEnglish
Article number2c05682
Pages (from-to)19462-19469
Number of pages8
JournalJournal of Physical Chemistry C
Volume126
Issue number45
Early online date10-Oct-2022
DOIs
Publication statusPublished - Nov-2022

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