Trends in tests and failure mechanisms in deep sub-micron technologies

Said Hamdioui; Zaid Al-Ars; Lotfi Mhamdi; Georgi Gaydadjiev; Stamatis Vassiliadis

doi:10.1109/DTIS.2006.1708677

Trends in tests and failure mechanisms in deep sub-micron technologies

Said Hamdioui^*, Zaid Al-Ars, Lotfi Mhamdi, Georgi Gaydadjiev, Stamatis Vassiliadis

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

5 Citations (Scopus)

Abstract

The increasing integration density of semicon-ductor devices and the usage of new materials and inno-vative manufacturing techniques result in introducing new and gradually changing the types of failure mechanisms and defects that take place in manufactured silicon. This is particularly true for current deep sub-micron manufactur-ing technologies. As we approach the nanoscale domain, new types of fault models and test methods are needed to cope with the increasing complexity of the observed faulty behavior. This paper discusses the latest trends in testing and failure mechanisms in all stages of IC production.

Original language	English
Title of host publication	International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.
Publisher	IEEE
Pages	216-221
Number of pages	6
ISBN (Print)	9780-7803-9726-6
DOIs	https://doi.org/10.1109/DTIS.2006.1708677
Publication status	Published - 1-Dec-2006
Externally published	Yes
Event	2006 International Conference on Design and Test of Integrated Systems in Nanoscale Technology, IEEE DTIS 2006 - Tunis, Tunisia Duration: 5-Sept-2006 → 7-Sept-2006

Conference

Conference	2006 International Conference on Design and Test of Integrated Systems in Nanoscale Technology, IEEE DTIS 2006
Country/Territory	Tunisia
City	Tunis
Period	05/09/2006 → 07/09/2006

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title = "Trends in tests and failure mechanisms in deep sub-micron technologies",

abstract = "The increasing integration density of semicon-ductor devices and the usage of new materials and inno-vative manufacturing techniques result in introducing new and gradually changing the types of failure mechanisms and defects that take place in manufactured silicon. This is particularly true for current deep sub-micron manufactur-ing technologies. As we approach the nanoscale domain, new types of fault models and test methods are needed to cope with the increasing complexity of the observed faulty behavior. This paper discusses the latest trends in testing and failure mechanisms in all stages of IC production.",

author = "Said Hamdioui and Zaid Al-Ars and Lotfi Mhamdi and Georgi Gaydadjiev and Stamatis Vassiliadis",

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Hamdioui, S, Al-Ars, Z, Mhamdi, L, Gaydadjiev, G & Vassiliadis, S 2006, Trends in tests and failure mechanisms in deep sub-micron technologies. in International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.., 1708677, IEEE, pp. 216-221, 2006 International Conference on Design and Test of Integrated Systems in Nanoscale Technology, IEEE DTIS 2006, Tunis, Tunisia, 05/09/2006. https://doi.org/10.1109/DTIS.2006.1708677

Trends in tests and failure mechanisms in deep sub-micron technologies. / Hamdioui, Said; Al-Ars, Zaid; Mhamdi, Lotfi et al.

International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.. IEEE, 2006. p. 216-221 1708677.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Vassiliadis, Stamatis

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AB - The increasing integration density of semicon-ductor devices and the usage of new materials and inno-vative manufacturing techniques result in introducing new and gradually changing the types of failure mechanisms and defects that take place in manufactured silicon. This is particularly true for current deep sub-micron manufactur-ing technologies. As we approach the nanoscale domain, new types of fault models and test methods are needed to cope with the increasing complexity of the observed faulty behavior. This paper discusses the latest trends in testing and failure mechanisms in all stages of IC production.

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ER -

Trends in tests and failure mechanisms in deep sub-micron technologies

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