A discrete dislocation approach to grain boundary diffusion

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Samenvatting

Stresses, and their relaxation, in thin films at size scales on the order of (sub)micrometers are critical to the mechanical reliability of small devices. In this study we present a discrete dislocation dynamics framework to describe diffusional stress relaxation. We find a nearly linear relationship between the relaxed, residual tensile stress and grain size. The origin lies in the amount of diffused material and the opening profile along the grain boundary.

Originele taal-2English
TitelProceedings of 4th International Conference on Multiscale Materials Modeling, MMM 2008
RedacteurenAnter El-Azab
UitgeverijDepartment of Scientific Computing, Florida State University
Pagina's768-771
Aantal pagina's4
ISBN van elektronische versie9780615247816
StatusPublished - 2008
Evenement4th International Conference on Multiscale Materials Modeling, MMM 2008 - Tallahassee, United States
Duur: 27-okt.-200831-okt.-2008

Publicatie series

NaamProceedings of 4th International Conference on Multiscale Materials Modeling, MMM 2008

Conference

Conference4th International Conference on Multiscale Materials Modeling, MMM 2008
Land/RegioUnited States
StadTallahassee
Periode27/10/200831/10/2008

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