Samenvatting
Test data travels through a System on Chip (SOC) from the chip pins to the Core-Under-Test (CUT) and vice versa via a Test Access Mechanism (TAM). Conventionally, a TAM is implemented using dedicated communication infrastructure. However, also existing functional interconnect, such as a bus or Network on Chip (NOC), can be reused as TAM; this will reduce the overall design effort and associated silicon area. For a given core, its test set, and maximal bandwidth that the functional interconnect can offer between test equipment and core-under-test, our approach instantiates a test wrapper for the core-under-test such that the test length is minimized. Unfortunately, it is unavoidable that along with the test data also unused (idle) bits are transported. This paper presents a holistic TAM bandwidth under-utilization analysis when functional interconnect is considered for test data transportation. We classify the idle bits into four types that refer to the root-cause of bandwidth under-utilization and pinpoint design improvement opportunities. Experimental results show an average bandwidth utilization of 80%, while the remaining 20% is consumed by the idle bits.
Originele taal-2 | English |
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Pagina's (van-tot) | 453-464 |
Aantal pagina's | 12 |
Tijdschrift | Journal of electronic testing-Theory and applications |
Volume | 26 |
Nummer van het tijdschrift | 4 |
DOI's | |
Status | Published - aug.-2010 |
Extern gepubliceerd | Ja |