@inproceedings{75c2a8e9efcc47ab89ea71d0fc7d961b,
title = "Plasticity in polycrystalline thin films: A 2D dislocation dynamics approach",
abstract = "Thermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film-substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.",
author = "L Nicola and {Van der Giessen}, E and A Needleman",
year = "2003",
language = "English",
isbn = "1-55899-716-4",
series = "MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS",
publisher = "Materials Research Society",
pages = "159--163",
editor = "HM Zbib and DH Lassila and LE Levine and KJ Hemker",
booktitle = "MULTISCALE PHENOMENA IN MATERIALS-EXPERIMENTS AND MODELING RELATED TO MECHANICAL BEHAVIOR",
note = "Symposium on Multiscale Phenomena in Materials-Experiments and Modeling Related to Mechanical Behavior held at the 2003 MRS Spring Meeting ; Conference date: 22-04-2003 Through 24-04-2003",
}