Plasticity in polycrystalline thin films: A 2D dislocation dynamics approach

L Nicola*, E Van der Giessen, A Needleman

*Bijbehorende auteur voor dit werk

OnderzoeksoutputAcademicpeer review

1 Citaat (Scopus)

Samenvatting

Thermal stress evolution in polycrystalline thin films is analyzed using discrete dislocation plasticity. Stress develops in the film during cooling from a stress-free configuration due to the difference in thermal expansion coefficient between the film and its substrate. A plane strain formulation with only edge dislocations is used and each grain of the polycrystal has a specified set of slip systems. The film-substrate interface and the grain boundaries are impenetrable for the dislocations. Results are presented for two film thicknesses, with higher hardening seen for the thinner films.

Originele taal-2English
TitelMULTISCALE PHENOMENA IN MATERIALS-EXPERIMENTS AND MODELING RELATED TO MECHANICAL BEHAVIOR
RedacteurenHM Zbib, DH Lassila, LE Levine, KJ Hemker
Plaats van productieWARRENDALE
UitgeverijMaterials Research Society
Pagina's159-163
Aantal pagina's5
ISBN van geprinte versie1-55899-716-4
StatusPublished - 2003
EvenementSymposium on Multiscale Phenomena in Materials-Experiments and Modeling Related to Mechanical Behavior held at the 2003 MRS Spring Meeting - , Canada
Duur: 22-apr.-200324-apr.-2003

Publicatie series

NaamMATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
UitgeverijMATERIALS RESEARCH SOCIETY
Volume779
ISSN van geprinte versie0272-9172

Other

OtherSymposium on Multiscale Phenomena in Materials-Experiments and Modeling Related to Mechanical Behavior held at the 2003 MRS Spring Meeting
Land/RegioCanada
Periode22/04/200324/04/2003

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