@inproceedings{334238252172480488dea14588f0391f,
title = "Simulations of dislocation dynamics in aluminum interconnects",
abstract = "A discrete dislocation simulation of plastic deformation in metallic interconnects caused by thermal stress is carried out. The calculations are carried out using a two dimensional plane strain formulation with only edge dislocations. A boundary value problem is formulated and solved for the evolution of the thermal stress field and the evolution of the dislocation structure in the cross-section of the line as cooling proceeds. For lines with a small cross section (height or width less than 1 mum), the local concentration of stresses due to dislocation patterning strongly affects the overall stress build up and relaxation. The results show a clear dependence of the transverse stress development on the line aspect ratio.",
keywords = "PLASTICITY, STRESSES, LAYERS",
author = "L Nicola and {Van der Giessen}, E and A Needleman",
year = "2002",
language = "English",
isbn = "1-55899-667-2",
series = "MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS",
publisher = "Materials Research Society",
pages = "41--46",
editor = "A Zavaliangos and Tikare and EA Olevsky",
booktitle = "MODELING AND NUMERICAL SIMULATION OF MATERIALS BEHAVIOR AND EVOLUTION",
note = "Symposium on Modeling and Numerical Simulation of Materials Behavior and Evolution held at the 2002 MRS Spring Meeting ; Conference date: 02-04-2002 Through 05-04-2002",
}