Simulations of dislocation dynamics in aluminum interconnects

L Nicola*, E Van der Giessen, A Needleman

*Bijbehorende auteur voor dit werk

OnderzoeksoutputAcademicpeer review

1 Citaat (Scopus)

Samenvatting

A discrete dislocation simulation of plastic deformation in metallic interconnects caused by thermal stress is carried out. The calculations are carried out using a two dimensional plane strain formulation with only edge dislocations. A boundary value problem is formulated and solved for the evolution of the thermal stress field and the evolution of the dislocation structure in the cross-section of the line as cooling proceeds. For lines with a small cross section (height or width less than 1 mum), the local concentration of stresses due to dislocation patterning strongly affects the overall stress build up and relaxation. The results show a clear dependence of the transverse stress development on the line aspect ratio.

Originele taal-2English
TitelMODELING AND NUMERICAL SIMULATION OF MATERIALS BEHAVIOR AND EVOLUTION
RedacteurenA Zavaliangos, Tikare, EA Olevsky
Plaats van productieWARRENDALE
UitgeverijMaterials Research Society
Pagina's41-46
Aantal pagina's6
ISBN van geprinte versie1-55899-667-2
StatusPublished - 2002
EvenementSymposium on Modeling and Numerical Simulation of Materials Behavior and Evolution held at the 2002 MRS Spring Meeting - , Canada
Duur: 2-apr.-20025-apr.-2002

Publicatie series

NaamMATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
UitgeverijMATERIALS RESEARCH SOCIETY
Volume731
ISSN van geprinte versie0272-9172

Other

OtherSymposium on Modeling and Numerical Simulation of Materials Behavior and Evolution held at the 2002 MRS Spring Meeting
Land/RegioCanada
Periode02/04/200205/04/2002

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